Researchers at the Massachusetts Institute of Technology (MIT) have developed an origami-inspired construction method that could enable the fabrication of lightweight, rigid structures using less material and simpler assembly techniques. The approach could eventually be used for emergency shelters, architectural components and lightweight aerospace parts.

The modular system uses components cut from flat sheets of material, folded into shape and connected to form three-dimensional structural shells. According to MIT, simulations indicate that the structures can be approximately 3.5 times stiffer than those produced using some other structural origami techniques, while requiring only about two-thirds as much material.The research was announced by MIT on October 27 and published in the International Journal of Solids and Structures.

Building structures through folding

The researchers drew inspiration from geometric patterns developed by artist and scientist Ron Resch in the 1960s. Unlike methods that fold a single sheet into a complete structure, the new approach uses individually fabricated components that are folded and connected to create a larger framework.

Alfonso Parra Rubio, a graduate student at MIT’s Center for Bits and Atoms and lead author of the study, developed a method for combining two tripod-shaped units into a rigid building block. These blocks can be interconnected to form a network of beams that creates a lightweight structural shell.

To simplify the design process, the team developed computational software that automatically generates components according to the intended structure. The software checks whether individual units can be folded before combining them into the final design.

The resulting files can be sent to computer-controlled cutting equipment to manufacture components from flat sheets of material, including aluminium. Workers can then fold and assemble the units using basic hand tools, without requiring large-scale welding equipment.

Demonstration at architectural scale

To demonstrate the method’s scalability, the researchers constructed a 23-foot folded-aluminium sculpture that was installed in the atrium of the Boston Public Library. According to MIT, a team without professional construction experience assembled the structure in a matter of days.

The researchers say the modular design simplifies assembly because the components are engineered to fit into their intended positions as the structure takes shape.

Representational image.Image credit:Pexels

However, the reported stiffness improvements are based on simulations comparing the method with other origami-based systems. Further testing will be necessary to establish its performance across different materials, loading conditions and real-world construction environments.

Potential applications

One potential application is disaster-relief housing. Flat-packed components could be transported efficiently to areas affected by earthquakes or floods and assembled on site, potentially reducing transportation and construction requirements.

The approach could also be explored for lightweight aerospace components, modular robots, sound-dampening panels and building facades. Its ability to create rigid structural shells without interior support columns could offer additional flexibility in architectural design.

The researchers plan to test the technique in larger architectural structures and investigate more complex component geometries that could improve strength and stiffness. They also intend to develop a more accessible interface for designing structures using the system.

While the method has yet to demonstrate widespread use in buildings, the research illustrates how geometric design and digital manufacturing could offer alternatives for constructing complex structures.

Its practical adoption will depend on factors including durability, manufacturing costs, structural safety and performance under real-world conditions. Nevertheless, the approach presents a potential option for applications where reducing material use and simplifying assembly are priorities.

India’s electronics manufacturing industry is expanding rapidly, but its dependence on imported semiconductors remains a significant challenge. A new industry report highlights the gap between the country’s growing electronics production and its efforts to establish a self-reliant semiconductor ecosystem.

India’s annual semiconductor import bill has reached ₹2.8785 lakh crore, according to the State of India’s Semiconductor Industry 2026 report released by the Data Security Council of India (DSCI) on October 23. The report estimates that India continues to depend on imports for 90–95 per cent of its semiconductor requirements.

The findings underline a central challenge in India’s technology ambitions: expanding the production of electronic devices while reducing dependence on foreign suppliers for the chips and components that power them.

Electronics production rises, but dependence persists

India’s electronics manufacturing industry has grown considerably over the past decade. According to government figures, electronics production increased from approximately ₹1.9 lakh crore in 2014–15 to ₹13.11 lakh crore in 2025–26. Electronics exports rose from around ₹38,000 crore to ₹4.24 lakh crore over the same period.

However, growth in electronics manufacturing does not necessarily mean that the components used in these products are manufactured domestically.

Semiconductors are essential to smartphones, computers, automobiles, telecommunications equipment and data centres. Their production involves complex processes requiring specialised facilities, advanced equipment, materials and highly skilled workers.

India has developed a substantial electronics assembly and manufacturing base, but building a semiconductor ecosystem requires investment across several stages, from chip design and wafer fabrication to assembly, testing and packaging.

The distinction matters because a country can manufacture and export electronic devices while continuing to import many of the high-value components used in them. Reducing semiconductor imports therefore requires strengthening domestic production capabilities rather than simply increasing the number of devices assembled within the country.

Five manufacturing units enter production

India launched the Semicon India Programme in 2021 with an initial outlay of ₹76,000 crore to establish a domestic semiconductor and display manufacturing ecosystem.

According to government figures and the DSCI report, 12 semiconductor manufacturing projects have been approved, involving investments exceeding ₹1.64 lakh crore. Five units have commenced commercial production.

The approved projects include silicon and silicon carbide fabrication facilities, a gallium nitride micro-LED display facility, and nine units focused on assembly, testing and packaging.

These facilities represent an important step towards establishing domestic semiconductor manufacturing capacity. However, the commencement of production does not, by itself, establish how much domestic demand the facilities can meet or how quickly they can reduce import dependence.

The government approved Semicon 2.0 in July 2026 with an outlay of ₹1,27,500 crore. The programme aims to strengthen research and development, chip design, manufacturing equipment, materials, workforce development and advanced packaging.

The broader objective is to develop an ecosystem in which domestic manufacturers can access more of the infrastructure and specialised services required to produce semiconductors.

Strengthening the supply chain

Semiconductor manufacturing depends on more than fabrication plants. It requires specialised materials, sophisticated machinery, reliable infrastructure, research capabilities and trained personnel.

A May 2026 roadmap by NITI Aayog identified India’s dependence on imported semiconductors and components as a vulnerability, particularly given the concentration of global manufacturing capacity in a limited number of countries.

Supply disruptions can affect industries ranging from automobiles and consumer electronics to telecommunications and defence. A shortage of critical chips can interrupt production even when manufacturers have sufficient capacity to assemble the final product.

India’s policy response has consequently extended beyond semiconductor fabrication. The Electronics Component Manufacturing Scheme seeks to develop domestic suppliers and strengthen the production of components used across the electronics industry.

Detailed view of organized electronic circuit boards in a production setting.Image credit:Pexels

Government figures published in September indicated that 106 projects had been approved under the scheme by August, with 38 approved plants already producing components.

Developing these supporting industries could help domestic manufacturers access more components locally. Nevertheless, the extent to which this reduces semiconductor dependence will depend on the types of components produced, their quality, cost and ability to meet industrial demand.

The workforce challenge

India’s established strength in semiconductor design offers another opportunity. The country has a large pool of engineers working in chip design and related technology services. Translating this advantage into manufacturing capacity, however, requires additional skills and infrastructure.

Operating semiconductor fabrication facilities involves specialised knowledge of materials, manufacturing processes, equipment maintenance and quality control. Assembly, testing and packaging also require trained technicians and engineers.

The DSCI report identifies workforce development as a priority, including the need to train approximately one lakh factory-floor technicians.

Such training will be essential if new facilities are to operate efficiently and expand production. Collaboration between industry, technical institutions and research organisations could help address the skills gap, although the availability of trained personnel alone cannot guarantee commercially competitive manufacturing.

Beyond factory announcements

India’s semiconductor ambitions reflect a wider effort to strengthen technological security and reduce exposure to international supply disruptions. Yet progress cannot be measured solely by the number of approved projects or the investments announced.

The more significant indicators will be sustained commercial production, manufacturing yields, domestic value addition, the development of local suppliers and the ability to meet demand at competitive prices.

India’s expanding electronics exports demonstrate the strength of its manufacturing growth. Its semiconductor import bill, meanwhile, illustrates the gap between assembling electronic products and producing the critical components within them.

Bridging that gap will require sustained investment in research, infrastructure, skilled labour and the supporting industries that make semiconductor production possible. Whether India’s new manufacturing projects can translate policy ambitions into a resilient domestic supply chain will determine how far the country can move towards semiconductor self-reliance.

India is developing research facilities and supporting projects that use engineered microorganisms to produce useful chemicals and other biological products. These efforts are part of a wider push to expand biotechnology-based manufacturing, a subject discussed at a meeting hosted by the International Centre for Genetic Engineering and Biotechnology (ICGEB) in New Delhi on October 26. The meeting was held ahead of the Emerging Science, Technology and Innovation Conclave ESTIC 2026, which begins in New Delhi on October 27.

Synthetic biology allows scientists to modify living cells or organisms so they can perform specific tasks. Researchers can engineer bacteria or yeast to produce particular chemicals, for example. Systems biology studies how different parts of a living organism, including genes, proteins and cells, interact.

India has already begun building infrastructure for this work. The Department of Biotechnology’s BioE3 initiative includes a network of biofoundries, specialised facilities that use automated equipment and biological research methods to design, test and improve microorganisms for manufacturing.

A report published by Nature India in August 2025 described the publicly funded biofoundry at ICGEB in New Delhi, where researchers are working to engineer bacteria and yeast to produce substances such as fuels, cosmetics ingredients and speciality chemicals. The facility uses automation and artificial intelligence to test biological designs more quickly.

The Department of Biotechnology has also reported research projects involving engineered yeast for the production of squalene and linalool at CSIR-CFTRI in Mysuru. These substances have applications in areas such as cosmetics, food and fragrances. The work includes efforts to scale up production, although research and scale-up do not necessarily mean that a product is already being manufactured commercially.

ESTIC 2026: From Laboratory to Products

Developing a biological process is only one stage of making a useful product. Researchers must also establish whether it works reliably, whether production can be scaled up and whether the final product can be manufactured at a competitive cost.

This challenge was highlighted by Dr Rajesh S. Gokhale, Secretary of the Department of Biotechnology (DBT), at the ICGEB meeting. Referring to the discovery and large-scale production of penicillin, he stressed the importance of moving scientific discoveries towards practical applications through research, development and scale-up.

Prof. Gobardhan Das, Member of NITI Aayog and the chief guest, cited the development of COVID-19 vaccines as an example of fundamental biological research contributing to public health. Dr Dhananjay Kumar Tiwary, Scientist-H at the DBT and Managing Director of the Biotechnology Industry Research Assistance Council (BIRAC), discussed the potential of system and synthetic biology in healthcare, biomanufacturing and biodesign. He also highlighted the role of artificial intelligence in biological research and the opportunities offered by the BioE3 Policy.

The policy, which stands for Biotechnology for Economy, Environment and Employment, aims to strengthen biotechnology-based manufacturing and support the development of bio-based products. The research and infrastructure being developed under this effort could help expand the range of substances produced using biological processes.

ESTIC Brings Researchers and Industry Together

The ICGEB meeting preceded ESTIC 2026, scheduled for October 27–29 at Bharat Mandapam in New Delhi. Organised by the Council of Scientific and Industrial Research (CSIR), under the guidance of the Office of the Principal Scientific Adviser to the Government of India, the conclave brings together scientists, researchers, policymakers and industry representatives.

Its 12 thematic areas include system and synthetic biology, advanced manufacturing, artificial intelligence, energy technologies, semiconductors and advanced healthcare. The DBT is steering a dedicated session on system and synthetic biology.

For India, a key test will be whether investments in research facilities and engineered biological processes lead to products that can be manufactured reliably and used at scale. The biofoundry programme offers one route towards that goal, though its long-term impact will depend on research outcomes, industrial partnerships and the ability to take promising processes beyond the laboratory.